Assembly and cabling
OVERVIEW
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The assembly of components (SMD and through-hole) on printed circuit boards
and hybrids is the activity of the TS-DEM-WS service. Also cables and crates
are made and wired. The in-house service is
optimised for prototype quantities and is able to organise the outsourcing of
productions.
The facility can also quickly (often within 30 minutes) change
components or repair cables; a service highly appreciated by physicists
preparing for the test-beam. |
In-house capabilities
- mounting of through-hole components
- mounting of surface mount devices (SMD)
- PLCC, SOIC
- BGA, fineline BGA downto 0.8 mm pitch
- resistors and capacitors downto 0201 size
- replacing of components, including BGA
- replacing of light radioactive components
- organisation of wire-bonding of chips and detectors
- production of cables (coax, flatcables, twisted pair...)
- prototyping of crates
- 30-minute express service for small interventions
- cleaning of soldered boards (don't underestimate the need for
this)
- leaded and lead-free solder capabilities
- QA using IPC-A-610 "Acceptability of Electronic Assemblies". Class 2 and
3.
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Automatic solder paste dispenser |
Outsourcing capabilities
- medium size productions with any type of components
- BGA, fineline BGA downto 0.5 mm pitch with X-ray checking
- outsourcing to several local companies and other industries in Europe
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Advice
- Component selection
- connectors and cables
- passive components (sizes and types)
- Crate prototyping
- selection of crates, panels
- Assembly
- Design For Manufacturing
- Design For Test
- leadfree soldering techniques and RoHS regulation
- Cleaning of PCBs (flux, handling)
- Audit of assembly companies
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integration mechanics/electronics
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mounting of SMD components
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cabling of crates and switchboards |

fabrication of cables |
How to use the assembly and cabling service
When the DEM-BE design office has drawn your board or hybrid you will
automatically use this service. In case you have made your own board, you first
should see the section leader of the DEM-WS section (Betty
Magnin).
We provide the components that are available from the CERN Stores and SMD
resistors and capacitors (1206, 0805, 0603 size). You only have to bring your
own ICs and other special components. In some cases the design office DEM-BE will need to make files that are needed
for the production (solder mask, colour plots of assembly).
For the
bonding of chips or detectors, we collaborate with the
PH bonding lab to guarante a coordination between the different assembly and cleaning
steps.
For prototype assembly outside CERN, we have negotiated contracts with
several companies. Those
contracts are based on a large volume and have followed the official CERN/SPL
tendering procedures. Please contact Betty
Magnin
to get details on how to make use of those contracts.
For rework on PCBs, such as replacing connectors or components
(including BGAs) you can go directly to the workshop located in
building 1/1-015)
or call them before on 72694. In most cases you
can have your board back within half an hour!
As the DEM-WS section has a large knowledge of components such as connectors
and small mechanics, they can also help you
with the selection for your circuit, even before you start making your
schematics. Concerns like price and manufacturability can all be taken into
account.
Next steps
After your design is assembled, it is up to you to test it. We wish you good
luck with this. If it happens that you find any layout, manufacturing or
assembly problem, please let us know. We'll do our best to correct it as soon as
possible.
DOCUMENTATION
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BGA inspection |
CONTACTS
Other cabling support
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